The global Copper Paste for PCB market was valued at US dollars 129.97 million in 2023 and is anticipated to reach US dollars 177.65 million by 2030, witnessing a CAGR of 5.10 percent during the forecast period 2024 to 2030.

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Copper paste for PCB or Printed Circuit Board is a conductive paste used to fill voids or gaps in copper traces or to repair damaged copper traces on a PCB. It is typically made from a mixture of copper particles and a binder or copyright material such as silicone or epoxy. The paste is applied to the PCB using a syringe or other dispensing tool and then cured or sintered to create a conductive bond between the copper particles.

The Japan market for Copper Paste for PCB is estimated to increase from US dollars 64.04 million in 2023 to reach US dollars 85.41 million by 2030, at a CAGR of 4.88 percent during the forecast period 2024 through 2030.

The China market for Copper Paste for PCB is estimated to increase from US dollars 27.08 million in 2023 to reach US dollars 41.83 million by 2030, at a CAGR of 6.87 percent during the forecast period 2024 through 2030.

Major global manufacturers of Copper Paste for PCB include Sumitomo Metal Mining Kyoto Elex Tatsuta Chang Sung Corporation NAMICS Mitsuboshi Belting Asahi Solder Heraeus Shoei Chemical Asahi Chemical Yuhon Copprint PrintCB and Ampletec. In 2023, the top three vendors accounted for approximately 49.00 percent of total revenue.

This report provides a comprehensive presentation of the global Copper Paste for PCB market with both quantitative and qualitative analysis. It helps readers develop business and growth strategies, assess the competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Paste for PCB.

Market size estimations and forecasts are provided in terms of output or shipments measured in kilograms and revenue in US dollars millions. The base year is 2023, with historical and forecast data spanning from 2019 to 2030. This report segments the global Copper Paste for PCB market by type, by application, by company, and by region. Regional market sizes and details concerning products by type, by application, and by key players are also provided.

For a more in-depth understanding, the report offers profiles of the competitive landscape, key competitors, and their market ranks. The report also discusses technological trends and new product developments shaping the industry.

This analysis helps Copper Paste for PCB manufacturers, new entrants, and industry chain related companies with information on revenues, production, and average price for the overall market and subsegments across different categories by company, by type, by application, and by region.

Market Segmentation

By Company
Sumitomo Metal Mining
Kyoto Elex
Tatsuta
Chang Sung Corporation
NAMICS
Mitsuboshi Belting
Asahi Solder
Heraeus
Shoei Chemical
Asahi Chemical
Yuhon
Copprint
PrintCB
Ampletec

Segment by Type
Low Temperature Sintered
Medium Temperature Sintered
High Temperature Sintered

Segment by Application
Consumer Electronics
Communications
Industrial and Medical
Automotive
Military and Aerospace
Others

Production by Region
North America
Europe
China
Japan
South Korea

Consumption by Region
North America
United States
Canada
Asia Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Australia
Europe
Germany
France
United Kingdom
Italy
Spain
Rest of Europe
Latin America
Mexico
Brazil
Argentina
Middle East and Africa
Israel
GCC Countries
Turkey
South Africa

The global Copper Paste for PCB market is expected to experience steady growth driven by increasing demand for high-performance electronic devices, rising investments in consumer electronics, and growing automotive and aerospace applications. Technological advances in binder chemistries and particle size control will continue to improve paste performance and reliability. Companies that focus on innovation, quality, and strategic partnerships are likely to strengthen their market position and capture emerging opportunities from 2025 through 2031.

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